OCP-IP Provides Virtual Platform Leveraging OVP ARM Models

Uses  OVP ARM Integrator platform,  OVP ARM processor models and OCP-IP SystemC TLM Modeling kit

Open Core Protocol International Partnership (OCP-IP), the organization delivering a common standard for intellectual property core interfaces that facilitate "plug and play" SoC design, and CircuitSutra, experts in SystemC modeling and embedded software development, along with Imperas, the company providing the infrastructure for the future of software virtual platforms and enabling the next generation of embedded software development, today announced the availability of a Virtual Platform Demo created utilizing OCP-IP's advanced Modeling Kit. This example platform acts as a guide to OCP-IP members enabling them to quick-start their ESL activities using the OCP-IP TLM Modeling Kit; which is fully compatible with OSCI's TLM 2.0.1. Both the kit and Virtual Platform examples are free to both OCP-IP members and non-members.

The Virtual Platform Demo utilizes Open Virtual Platforms (OVP) technology...

For more information, please read the full press release here, or download it here.

You can get the virtual platform here, and see the OVP information here and here.

For the CircuitSutra presentation on the virtual platform visit here.

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